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XLF-861+ - Mini-Circuits

Description: Signal Conditioning REFLECTIONLESS LOW PASS FILTER

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PCB Footprints
XLF-861+ - Mini-Circuits PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 3 x 3mm 12-lead MCLP
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3D Models
XLF-861+ - Mini-Circuits  - 3D model - Quad Flat No-Lead - 3 x 3mm 12-lead MCLP
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XLF-861+ Details

  • Manufacturer Part Number:

    XLF-861+

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Mini-Circuits

  • YTEOL:

    7.6

  • Average Input Power:

    2 W

  • Center or Cutoff Frequency (fo/fc):

    1150 MHz

  • Filter Type:

    LOW PASS FILTER

  • Height:

    0.89 mm

  • Input Impedance:

    50 OHM

  • Insertion Loss-Max:

    1.8 dB

  • Length:

    3 mm

  • Mounting Type:

    SURFACE MOUNT

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Impedance:

    50 OHM Ω

  • Packing Method:

    TR, 7 INCH

  • VSWR:

    1.2

  • Width:

    3 mm

XLF-861+ Frequently Asked Questions (FAQs)

  • Mini-Circuits provides a recommended PCB layout and footprint in their application notes and evaluation board documentation. It's essential to follow these guidelines to ensure optimal performance, especially for high-frequency applications.
  • To achieve the best possible noise figure, ensure that the input and output impedances are properly matched, and the device is operated within its recommended operating conditions. Additionally, using a high-quality, low-noise power supply and proper grounding techniques can help minimize noise.
  • While the datasheet provides some information on power handling, it's essential to note that the maximum power handling capability of the XLF-861+ depends on various factors, including the operating frequency, temperature, and input/output impedance. It's recommended to consult with Mini-Circuits' application engineers or perform thorough testing to determine the maximum power handling capability for a specific application.
  • Yes, the XLF-861+ can be used in a push-pull or balanced configuration to improve performance, such as increased output power and reduced distortion. However, it's crucial to ensure that the device is properly biased and matched in this configuration, and that the input and output impedances are properly terminated.
  • Proper thermal management is essential to ensure the reliability and performance of the XLF-861+. The device has a maximum junction temperature of 150°C, and it's recommended to keep the operating temperature below 100°C. Ensure good airflow, use a heat sink if necessary, and follow proper PCB design and layout guidelines to minimize thermal resistance.

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XLF-861+ Overview

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About Mini-Circuits

Mini-Circuits is a global leader in the design, manufacturing, and distribution of RF and microwave components and systems. The company's product portfolio includes a vast array of components such as amplifiers, mixers, splitters, couplers, filters, switches, and attenuators, among others. These components cover frequency ranges from DC to 65 GHz and beyond, serving applications in wireless communication, satellite communication, radar systems, test and measurement equipment, medical devices, and more.

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