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XMC1301T016F0016ABXUMA1 - Infineon

Description: ARM Microcontrollers - MCU XMC1000 Microcontroller Series for Industrial Applications ARM Cortex-M0 32-bit processor core

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XMC1301T016F0016ABXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 4.9*4.3mm
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XMC1301T016F0016ABXUMA1 - Infineon  - 3D model - Small Outline Packages - 4.9*4.3mm
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XMC1301T016F0016ABXUMA1 Details

  • Manufacturer Part Number:

    XMC1301T016F0016ABXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    14

  • Number of Terminals:

    16

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • RAM (bytes):

    16384

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    32 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

XMC1301T016F0016ABXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN1905, which includes guidelines for component placement, routing, and thermal management.
  • To optimize power consumption, use the device's low-power modes (e.g., sleep mode, standby mode), reduce clock frequencies, and minimize peripheral usage. Additionally, use the device's built-in power management features, such as the Power Management Controller (PMC).
  • The XMC1301T016F0016ABXUMA1 has an operating temperature range of -40°C to +125°C, but it's recommended to operate within -20°C to +85°C for optimal performance and reliability.
  • To ensure EMC, follow Infineon's guidelines for PCB layout, component selection, and shielding. Additionally, use EMI filters, and consider using a metal shield or a Faraday cage to reduce electromagnetic radiation.
  • Infineon recommends using decoupling capacitors with a value of 100 nF to 1 μF, and a voltage rating of 2.5 V to 3.3 V, placed as close as possible to the device's power pins.

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