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XP161A11A1PR-G - Torex

Description: MOSFET Power MOSFET, 30V, 4A, N-Type, SOT-89

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PCB Footprints
XP161A11A1PR-G - Torex PCB footprint - Other - Other - XP161A11A1PR-G-3
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3D Models
XP161A11A1PR-G - Torex  - 3D model - Other - XP161A11A1PR-G-3
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XP161A11A1PR-G Details

  • Manufacturer Part Number:

    XP161A11A1PR-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Torex Semiconductor LTD

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Drain Current-Max (ID):

    4 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Time@Peak Reflow Temperature-Max (s):

    10

XP161A11A1PR-G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short, wide traces for the power lines.
  • Use a high-quality input capacitor (e.g., X5R or X7R) with a capacitance value of at least 10uF, and ensure the input voltage is within the recommended range (2.5V to 5.5V).
  • The maximum output current is 1A, but it's recommended to limit the output current to 0.8A for optimal performance and to prevent overheating.
  • Use a thermal pad or a heat sink with a thermal conductivity of at least 1 W/m-K. Ensure good airflow around the IC, and avoid blocking the thermal pad with components or copper traces.
  • The XP161A11A1PR-G is rated for operation up to 85°C. For high-temperature applications, consider using a heat sink or a thermal interface material to ensure reliable operation.

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