Cree recommends a PCB layout with a thermal pad size of at least 2.5mm x 2.5mm, and a thermal via array with a minimum of 10 vias. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K is recommended. For more information, refer to Cree's application note AN-1102.
Cree recommends following the soldering profile outlined in the datasheet, with a peak temperature of 260°C and a dwell time of 10-30 seconds. It's also essential to use a solder with a melting point above 217°C and to avoid applying excessive force or pressure during the assembly process.
The XPCRED-L1-R250-00201 has an operating temperature range of -40°C to 150°C. While the device can operate within this range, its performance may degrade at higher temperatures. For optimal performance, Cree recommends operating the device at temperatures below 125°C.
Cree recommends following standard ESD handling procedures, including the use of ESD-safe workstations, wrist straps, and packaging materials. The device has an ESD rating of 2 kV human body model (HBM) and 250 V machine model (MM).
Cree recommends storing the device in its original packaging, in a dry, cool place with a temperature range of 20°C to 30°C and humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
XPCRED-L1-R250-00201 Overview
Use the download button to access the XPCRED-L1-R250-00201 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like XPCRE,
or try a keyword search, such as Visible LEDs
