XQRVC1902-1MSBVSRA2197 - AMD

XQRVC1902-1MSBVSRA2197 Details

• Manufacturer Part Number:

  XQRVC1902-1MSBVSRA2197

• Part Life Cycle Code:

  Active

• Package Description:

  BGA-2197

• HTS Code:

  8542.31.00.30

• Manufacturer:

  AMD

• JESD-30 Code:

  S-PBGA-B2197

• Length:

  45 mm

• Number of Terminals:

  2197

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -55 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA2197,47X47,36

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Screening Level:

  MIL-PRF-38535

• Seated Height-Max:

  4 mm

• Supply Voltage-Max:

  0.825 V

• Supply Voltage-Min:

  0.775 V

• Supply Voltage-Nom:

  0.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  0.92 mm

• Terminal Position:

  BOTTOM

• Total Dose:

  100k Rad(Si) V

• Width:

  45 mm

• uPs/uCs/Peripheral ICs Type:

  SoC