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XZMDKVG54W-4 - SunLED

Description: LED GREEN/RED CLEAR CHIP SMD

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PCB Footprints
XZMDKVG54W-4 - SunLED PCB footprint - Other - Other - 2x1.25 SMD CHIP LED LAMP
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XZMDKVG54W-4 Details

  • Manufacturer Part Number:

    XZMDKVG54W-4

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8541.40.20.00

  • Manufacturer:

    SunLED Group

  • YTEOL:

    6

  • Color:

    RED/GREEN

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • Forward Current-Max:

    0.03 A

  • Lens Type:

    WATER CLEAR

  • Luminous Intensity-Nom:

    198.0/79.0 mcd

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    DUAL COLOR LED

  • Overall Height:

    0.45 mm

  • Packing Method:

    TR

  • Peak Wavelength:

    650/574 nm

  • Shape:

    RECTANGULAR

  • Size:

    1.3 mm

  • Surface Mount:

    YES

  • Terminal Pitch:

    1.8 mm

  • Viewing Angle:

    120 deg

XZMDKVG54W-4 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range is -40°C to 85°C, but it's essential to note that the module's performance and lifespan may degrade if operated outside the recommended temperature range.
  • Proper thermal management is crucial. Ensure good airflow around the module, and consider using a heat sink or thermal interface material to maintain a junction temperature below 120°C.
  • The maximum forward current rating is 700mA. Exceeding this rating may lead to reduced lifespan or even damage to the module.
  • Yes, the XZMDKVG54W-4 is suitable for outdoor applications, but ensure proper sealing and protection from environmental factors like moisture, dust, and extreme temperatures.
  • Handle the module by the edges to prevent damage to the LEDs or electrical connections. Use a soldering iron with a temperature below 260°C, and avoid applying excessive force or bending the module during assembly.

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XZMDKVG54W-4 Overview

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