A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a solid ground plane is suggested to reduce thermal resistance. Additionally, placing thermal vias under the IC can improve heat dissipation.
To ensure stable output voltage regulation, it's essential to follow the recommended input and output capacitor values, and to place them close to the IC. Also, make sure the input voltage is within the specified range, and the output current is within the maximum rating.
The maximum allowable ripple voltage on the input is typically 1% of the input voltage, but it's recommended to keep it as low as possible to ensure stable operation and minimize output voltage ripple.
While ceramic capacitors can be used, they may not be the best choice due to their limited capacitance and high ESR. A low-ESR electrolytic capacitor or a polymer capacitor is recommended for the output capacitor to ensure stable operation and low output voltage ripple.
The power dissipation of the IC can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current.
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