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ZMY5.6G - Diotec

Description: Zener Diodes Zener, Glass-Melf, 5.6V, 1W, 5%

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ZMY5.6G Details

  • Manufacturer Part Number:

    ZMY5.6G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-213AB

  • Package Description:

    ROHS COMPLIANT, GLASS, MELF-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    6.25

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    2 Ω

  • JEDEC-95 Code:

    DO-213AB

  • JESD-30 Code:

    O-LELF-R2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -50 °C

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    5.6 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Form:

    WRAP AROUND

  • Terminal Position:

    END

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    100 mA

ZMY5.6G Frequently Asked Questions (FAQs)

  • The recommended storage temperature range for ZMY5.6G is -40°C to 125°C.
  • Yes, the ZMY5.6G is suitable for high-reliability applications due to its robust design and manufacturing process, which ensures a low failure rate.
  • To prevent damage during soldering, ensure the ZMY5.6G is exposed to a maximum temperature of 260°C for no more than 10 seconds, and use a soldering iron with a temperature range of 200°C to 240°C.
  • For optimal thermal performance, it is recommended to use a PCB layout with a large copper area connected to the tab of the ZMY5.6G, and ensure good thermal conductivity between the PCB and the heat sink.
  • Yes, you can use multiple ZMY5.6G devices in parallel to increase the current rating, but ensure that each device has its own separate heat sink and that the total current rating is within the maximum allowed by the devices.

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ZMY5.6G Overview

Use the download button to access the ZMY5.6G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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Part Image ZMY5.6G Micro Commercial Components

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For a full list of alternate parts for ZMY5.6G, check out Findchips.com