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ZXGD3004E6TA - Diodes Incorporated

Description: MOSFET Driver 40V 8A High Speed SOT23-6 DiodesZetex ZXGD3004E6TA, MOSFET Power Driver 8A, Maximum of 40 V, Non-Inverting, 6-Pin SOT-23

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PCB Footprints
ZXGD3004E6TA - Diodes Incorporated PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - ZXGD3004E6TA*
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3D Models
ZXGD3004E6TA - Diodes Incorporated  - 3D model - SOT23 (6-Pin) - ZXGD3004E6TA*
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ZXGD3004E6TA Details

  • Manufacturer Part Number:

    ZXGD3004E6TA

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT23, 6 PIN

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Output Peak Current Limit-Nom:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    40 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.036 µs

  • Turn-on Time:

    0.032 µs

  • Width:

    1.55 mm

ZXGD3004E6TA Frequently Asked Questions (FAQs)

  • A good PCB layout for the ZXGD3004E6TA should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces near the device to minimize thermal resistance.
  • To ensure reliable operation across the full temperature range (-40°C to 150°C), follow the recommended operating conditions, and consider the device's thermal derating. Ensure proper thermal management, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • The ZXGD3004E6TA has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, and consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • Yes, the ZXGD3004E6TA is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101, and Diodes Incorporated provides a dedicated automotive-grade version of the device. Ensure you follow the recommended operating conditions and qualification guidelines for your specific application.
  • Store the ZXGD3004E6TA in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the leads or die. Use anti-static packaging and follow proper ESD handling procedures to prevent damage during storage and handling.

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ZXGD3004E6TA Overview

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