SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Supply Voltage-Max:
60 V
Supply Voltage-Min:
8 V
Supply Voltage-Nom:
12 V
Surface Mount:
YES
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm
fmax-Min:
0.3 MHz
ZXLD1370EST16TC Frequently Asked Questions (FAQs)
A good PCB layout for the ZXLD1370EST16TC should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper coverage around the device. Avoid routing high-current traces near the device to minimize thermal resistance.
To ensure stable output voltage regulation, ensure that the input voltage is within the recommended range, and the output capacitor is of sufficient value and type (e.g., X5R or X7R ceramic). Additionally, minimize the distance between the output capacitor and the device, and use a low-ESR capacitor to reduce output voltage ripple.
The ZXLD1370EST16TC is rated for operation up to 125°C ambient temperature. However, for reliable operation, it's recommended to derate the device's power dissipation according to the ambient temperature, following the thermal derating curve provided in the datasheet.
Yes, the ZXLD1370EST16TC is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions, and consider additional testing and validation for your specific application.
Use the following formula to calculate power dissipation: Pd = (Vin - Vout) x Iout. Then, use the thermal resistance (RθJA) and the calculated power dissipation to estimate the junction temperature (Tj) using the formula: Tj = TAMB + (RθJA x Pd).
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ZXLD1370EST16TC Overview
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