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ZXMP6A13GTA - Diodes Incorporated

Description: P-Channel 60 V 1.7A (Ta) 2W (Ta) Surface Mount SOT-223-3

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PCB Footprints
ZXMP6A13GTA - Diodes Incorporated PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223 (Type DN)
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ZXMP6A13GTA - Diodes Incorporated  - 3D model - SOT223 (3-Pin) - SOT-223 (Type DN)
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ZXMP6A13GTA Details

  • Manufacturer Part Number:

    ZXMP6A13GTA

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-223

  • Package Description:

    SOT-223, 4 PIN

  • Pin Count:

    4

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    1

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    1.7 A

  • Drain-source On Resistance-Max:

    0.39 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    20.5 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    7.8 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ZXMP6A13GTA Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern around the thermal pad is suggested. Additionally, a solid ground plane on the bottom layer can help to reduce thermal resistance.
  • To ensure stable operation, it is recommended to decouple the input voltage with a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed as close to the device as possible. Additionally, a 10nF capacitor can be added in parallel to the input capacitor to filter out high-frequency noise.
  • The maximum safe operating area (SOA) for the ZXMP6A13GTA is limited by the maximum junction temperature (Tj) of 150°C. The device can operate safely within the SOA boundaries defined by the voltage and current ratings, but it is recommended to derate the device for reliable operation.
  • Yes, the ZXMP6A13GTA is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it is recommended to follow the recommended operating conditions and derating guidelines to ensure the device operates within its safe operating area.
  • To protect the device from ESD, it is recommended to handle the device by the body, avoid touching the pins, and use an ESD wrist strap or mat. The device should be stored in an anti-static bag or tube, and the PCB should be designed with ESD protection in mind, such as using ESD diodes or resistors.

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ZXMP6A13GTA Overview

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