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ZXMP6A16KTC - Diodes Incorporated

Description: Diodes Inc ZXMP6A16KTC P-channel MOSFET Transistor, 8.2 A, -60 V, 3-Pin D-PAK

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ZXMP6A16KTC - Diodes Incorporated PCB footprint - Other - Other - ZXMP6A16KTC-1
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ZXMP6A16KTC - Diodes Incorporated  - 3D model - Other - ZXMP6A16KTC-1
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ZXMP6A16KTC Details

  • Manufacturer Part Number:

    ZXMP6A16KTC

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    5.4 A

  • Drain-source On Resistance-Max:

    0.085 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    9.76 W

  • Pulsed Drain Current-Max (IDM):

    27.2 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ZXMP6A16KTC Frequently Asked Questions (FAQs)

  • A good PCB layout for the ZXMP6A16KTC should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces near the device to minimize thermal resistance.
  • To ensure reliable operation across the full temperature range (-40°C to 150°C), follow the recommended operating conditions, and consider the device's thermal derating. Ensure proper thermal management, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • The ZXMP6A16KTC has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, and consider adding external ESD protection devices if necessary.
  • Yes, the ZXMP6A16KTC is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101, and Diodes Incorporated provides a dedicated automotive-grade version of the device. Consult with Diodes Incorporated for specific requirements and documentation.
  • Follow the recommended soldering temperature profile, and ensure the device is handled and stored in a moisture-controlled environment. Use a soldering iron with a temperature range of 350°C to 370°C, and avoid applying excessive force or bending during assembly.

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ZXMP6A16KTC Overview

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