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ZXMP6A17E6QTA - Diodes Incorporated

Description: MOSFETs 60V P-Ch Enh Mode 1.1W 3A 637pF 17.7nC

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PCB Footprints
ZXMP6A17E6QTA - Diodes Incorporated PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT26
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3D Models
ZXMP6A17E6QTA - Diodes Incorporated  - 3D model - SOT23 (6-Pin) - SOT26
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ZXMP6A17E6QTA Details

  • Manufacturer Part Number:

    ZXMP6A17E6QTA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-26, 6 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    2.3 A

  • Drain-source On Resistance-Max:

    0.125 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    53 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.1 W

  • Pulsed Drain Current-Max (IDM):

    13.6 A

  • Reference Standard:

    AEC-Q101; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ZXMP6A17E6QTA Frequently Asked Questions (FAQs)

  • A good PCB layout for the ZXMP6A17E6QTA should include a solid ground plane, wide traces for power and ground, and a thermal relief pattern under the device. A minimum of 2oz copper thickness is recommended.
  • To ensure proper biasing, the ZXMP6A17E6QTA requires a stable input voltage, a low-impedance output, and a bias resistor (Rb) between the base and emitter. A typical value for Rb is 1kΩ to 10kΩ.
  • Handle the ZXMP6A17E6QTA by the body, not the leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and use anti-static packaging and handling procedures.
  • Yes, the ZXMP6A17E6QTA is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and ensure the device is qualified according to the specific industry standards (e.g., AEC-Q101).
  • The ZXMP6A17E6QTA has a junction-to-ambient thermal resistance (RθJA) of 62°C/W. Ensure good airflow, use a heat sink if necessary, and follow the recommended PCB layout to minimize thermal resistance.

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ZXMP6A17E6QTA Overview

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