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ZXTP19100CFFTA - Diodes Incorporated

Description: Bipolar Transistors - BJT PNP 100V Transistor

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ZXTP19100CFFTA - Diodes Incorporated - PCB symbol
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PCB Footprints
ZXTP19100CFFTA - Diodes Incorporated PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT23F
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3D Models
ZXTP19100CFFTA - Diodes Incorporated - 3D model - SO Transistor Flat Lead - SOT23F
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ZXTP19100CFFTA Details

  • Manufacturer Part Number:

    ZXTP19100CFFTA

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23F

  • Package Description:

    SOT-23F, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    4

  • Collector Current-Max (IC):

    2 A

  • Collector-Base Capacitance-Max:

    23.5 pF

  • Collector-Emitter Voltage-Max:

    100 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    20

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    1.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    142 MHz

  • VCEsat-Max:

    0.275 V

ZXTP19100CFFTA Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern around the thermal pad is suggested. Additionally, a solid ground plane on the bottom layer can help to reduce thermal resistance.
  • To ensure stable operation, it is recommended to decouple the input voltage with a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel. This will help to filter out any noise and ripple on the input voltage.
  • The maximum allowed power dissipation for the ZXTP19100CFFTA is 1.5W. However, it is recommended to derate the power dissipation based on the ambient temperature and the thermal resistance of the PCB.
  • The ZXTP19100CFFTA is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the power dissipation and ensure proper heat sinking to maintain a safe operating temperature.
  • To protect the device from ESD, it is recommended to handle the device by the body, use an ESD wrist strap or mat, and store the device in an anti-static bag or container. Additionally, the device should be soldered onto the PCB using an ESD-safe soldering iron.

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ZXTP19100CFFTA Overview

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Small Signal Bipolar Transistor, 2A I(C), 100V V(BR)CEO, 1-Element, PNP, Silicon