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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2132427-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Columns 8 | Number of Rows 9 | Number of Positions 72 | Backplane Architecture Orthogonal | PCB Mount Orientation Right Angle | Number of Pairs 24 | Stackable No | Guide Location Unguided | Number of Signal Positions 48 | Number of Ground Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Co | 2132427-1 |
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2132469-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Columns 10 | Number of Positions 120 | Number of Pairs 40 | Number of Signal Positions 80 | Stackable No | Number of Rows 12 | Backplane Architecture Orthogonal | PCB Mount Orientation Right Angle | Guide Location Unguided | Number of Ground Positions 40 | Contact Features: Contact Mating Area Plating Material Gold | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating M | 2132469-1 |
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2132441-1
TE Connectivity
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1 | IMP100O,R,RA3P6C,RG,46 | 2132441-1 |
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2132422-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Stackable No | Number of Rows 9 | Number of Signal Positions 36 | Guide Location Left | Backplane Architecture Orthogonal | Number of Columns 6 | Number of Ground Positions 18 | PCB Mount Orientation Right Angle | Number of Pairs 18 | Number of Positions 54 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 50 MICI | 2132422-1 |
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2132461-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Guide Location Left | Number of Pairs 24 | Backplane Architecture Orthogonal | Number of Positions 72 | Stackable No | Number of Rows 12 | Number of Columns 6 | Number of Ground Positions 24 | Number of Signal Positions 48 | PCB Mount Orientation Right Angle | Contact Features: Contact Shape & Form Dual Beam | Contact Underplating Material Thickness 1.27 MICM | Contact Type Socket | PCB Contact Termination Area Plating Material Thickness 5 | 2132461-1 |
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2132444-1
TE Connectivity
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1 | IMP100O,R,RA3P8C,RG,46 | 2132444-1 |
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2132466-5
TE Connectivity
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1 | TWO PART BOARD CONNECTOR | 2132466-5 |
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2132404-1
TE Connectivity
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1 | Packaging Features: Packaging Method Box | Product Type Features: Hardware Accessory Function Latching, Locking & Retention | Hardware Accessory Function Mounting | Connector Hardware Accessory Type Hardware Kit | | 2132404-1 |
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2132462-5
TE Connectivity
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1 | TWO PART BOARD CONNECTOR | 2132462-5 |
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2132465-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 32 | Number of Columns 8 | Stackable No | Number of Signal Positions 64 | Guide Location Right | Number of Rows 12 | PCB Mount Orientation Right Angle | Backplane Architecture Orthogonal | Number of Pairs 32 | Number of Positions 96 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 50 M | 2132465-1 |
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2132415-5
TE Connectivity
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1 | Headers & Wire Housings EP2.5 SHRD HDR ASSY 5P VERT W/O BOSS | 2132415-5 |
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2132468-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Positions 120 | Number of Signal Positions 80 | Backplane Architecture Orthogonal | Number of Ground Positions 40 | Stackable No | Number of Columns 10 | Number of Pairs 40 | PCB Mount Orientation Right Angle | Number of Rows 12 | Guide Location Right | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Shape & Form Dual Beam | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Ter | 2132468-1 |
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2132486-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 80 | Number of Positions 120 | PCB Mount Orientation Right Angle | Stackable No | Number of Pairs 40 | Number of Ground Positions 40 | Number of Rows 12 | Backplane Architecture Orthogonal | Number of Columns 10 | Guide Location Right | Contact Features: PCB Contact Termination Area Plating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 50 MICIN | Contact Mating Area Platin | 2132486-1 |
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2132445-1
TE Connectivity
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1 | IMP100O,R,RA3P8C,UG,46 | 2132445-1 |
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2132443-1
TE Connectivity
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1 | IMP100O,R,RA3P8C,LG,46 | 2132443-1 |
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2132462-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Positions 72 | Guide Location Right | Number of Pairs 24 | Number of Signal Positions 48 | Stackable No | Number of Rows 12 | Number of Ground Positions 24 | Number of Columns 6 | Backplane Architecture Orthogonal | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Thickness 50 MICIN | Contact Base Material Copper Alloy | Contact Type Socket | Contact Current Rating (Max) .75 AMP | 2132462-1 |
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2132425-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Guide Location Left | Number of Positions 72 | Number of Rows 9 | Number of Pairs 24 | Number of Signal Positions 48 | Number of Ground Positions 24 | Backplane Architecture Orthogonal | PCB Mount Orientation Right Angle | Number of Columns 8 | Stackable No | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Shape & Form Dual Beam | PCB Contact Termination Area Plating Material Tin | PCB Contact Termina | 2132425-1 |
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2132403-6
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 5 | Number of Positions 200 | Number of Ports 10 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Ce | 2132403-6 |
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2132426-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Columns 8 | Stackable No | Number of Ground Positions 24 | PCB Mount Orientation Right Angle | Backplane Architecture Orthogonal | Number of Pairs 24 | Number of Signal Positions 48 | Number of Positions 72 | Guide Location Right | Number of Rows 9 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Dual Beam | Contact Underplating Material Thick | 2132426-1 |
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2132487-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Columns 10 | Number of Pairs 40 | Guide Location Unguided | Number of Rows 12 | Number of Ground Positions 40 | Backplane Architecture Orthogonal | Stackable No | Number of Signal Positions 80 | PCB Mount Orientation Right Angle | Number of Positions 120 | Contact Features: PCB Contact Termination Area Plating Material Thickness 50 MICIN | Contact Shape & Form Dual Beam | Contact Base Material Copper Alloy | Contact Type Socket | | 2132487-1 |
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2132485-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 40 | Number of Ground Positions 40 | Number of Columns 10 | Guide Location Left | Stackable No | Number of Signal Positions 80 | PCB Mount Orientation Right Angle | Number of Rows 12 | Backplane Architecture Orthogonal | Number of Positions 120 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Type Socket | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Mater | 2132485-1 |
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Build or Request | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2132483-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 32 | Number of Positions 96 | Number of Signal Positions 64 | Guide Location Right | Number of Rows 12 | Backplane Architecture Orthogonal | PCB Mount Orientation Right Angle | Number of Columns 8 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Thickness 50 MICIN | Contact Base Material Coppe | 2132483-1 |
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2132423-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 9 | Guide Location Right | Number of Signal Positions 36 | Stackable No | Number of Pairs 18 | Number of Columns 6 | Number of Positions 54 | PCB Mount Orientation Right Angle | Number of Ground Positions 18 | Backplane Architecture Orthogonal | Contact Features: Contact Type Socket | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Finish Matte | Contact Shape & Form Dual Bea | 2132423-1 |
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2132403-8
TE Connectivity
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1 | Configuration Features: Number of Positions 200 | Number of Ports 10 | Port Matrix Configuration 2 x 5 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Cage Material Nickel Silver | Ce | 2132403-8 |
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2132467-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 12 | Number of Ground Positions 40 | Number of Columns 10 | Guide Location Left | Stackable No | Number of Signal Positions 80 | PCB Mount Orientation Right Angle | Number of Positions 120 | Number of Pairs 40 | Backplane Architecture Orthogonal | Contact Features: PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Mater | 2132467-1 |
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