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4-794620-2
TE Connectivity
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1 | Configuration Features: Number of Positions 12 | Number of Power Positions 12 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | | Other | 4-794620-2 |
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NCP4620HSN33T1G
onsemi
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1 | Obsolete - Linear Voltage Regulator, LDO, Wide Voltage Input, 150 mA | SOT23 (5-Pin) | NCP4620HSN33T1G |
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46207-4316
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 16 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-4316 |
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46207-1024
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 24 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-1024 |
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46207-1002
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 2 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-1002 |
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1874620000
Weidmüller
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1 | PCB terminal, 160 V, 17.5 A, Pitch in mm: 3.50, 1.5 mm², Number of poles: 9, PUSH IN with actuator, THT/THR solder connection, 180°, Tape | Other | 1874620000 |
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46207-5202
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 2 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5202 |
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1824620000
Weidmüller
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1 | PCB terminal, 160 V, 17.5 A, Pitch in mm: 3.81, 1.5 mm², Number of poles: 2, PUSH IN with push button, THT/THR solder connection, 90°, Tube | Other | 1824620000 |
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46207-1318
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 18 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-1318 |
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46207-4314
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 14 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-4314 |
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46207-1322
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 22 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-1322 |
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46207-1202
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 2 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-1202 |
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46207-0014
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 14 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-0014 |
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46207-6618
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 18 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-6618 |
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46207-0018
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 18 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-0018 |
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EXB-U14620JX
Panasonic
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1 | Series/Type: Anti-Sulfurated Chip Resistor Array, Power Rating (W): 0.031, Chip Size (LxW) (mm): 0.8 X 0.6, Resistance Values (?): 62, Resistance Tolerance (%): 5, Terminal Pitch (mm): 0.5, Type of Circuit: Isolated Circuit, Number of Elements (piece): 2, T.C.R (?104/K): ?200, Number of Terminals (piece): 4 | Other | EXB-U14620JX |
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EXB-U34620JV
Panasonic
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1 | Series/Type: Anti-Sulfurated Chip Resistor Array, Power Rating (W): 0.063, Chip Size (LxW) (mm): 1.6 X 1.6, Resistance Values (Ω): 62, Resistance Tolerance (%): 5, Terminal Pitch (mm): 0.8, Type of Circuit: Isolated Circuit, Number of Elements (piece): 2, T.C.R (×10⁻⁶/K): ±200, Number of Terminals (piece): 4 | Other | EXB-U34620JV |
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TSW-146-20-LM-S
SAMTEC
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1 | 46 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-146-20-LM-S |
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0462074020
Molex
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1 | Mini-Fit Jr. Reflow Solder Capable Header, 4.20mm Pitch, Dual Row, Vertical, 20 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Plating, Glow-Wire Capable, Tape and Reel | Other | 0462074020 |
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46207-7014
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 14 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-7014 |
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46207-6024
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 24 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-6024 |
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46207-5210
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 10 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5210 |
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PEV227HLP4620QE4
Yageo Group
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1 | Radial Surface Mount Aluminum Electrolytic | Other | PEV227HLP4620QE4 |
3
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46207-7022
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 22 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-7022 |
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15246203
Molex
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1 | Mini-Fit BMI Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 20 Circuits, PA Polyamide Nylon | Other | 15246203 |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/047/946/202/4-794620-2-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/047/946/202/4-794620-2-t1.jpg/jcr:content/renditions/product-details.png",null])
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