2126- Model Download Search Results
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TSW-121-26-SM-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-26-SM-S |
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SL512126Z
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | SL512126Z |
3
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824521261
Würth Elektronik
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1 | WE-TVSP Power TVS Diode " SMBJ26CA " ; Size DO-214AA; bidirectional; P Diss = 600 W; V DC = 26 V; V BR = 30.4 V; I Peak = 14.3 A; V Clamp = 42.1 V @ 14.3 A | Diodes Moulded | 824521261 |
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3212-60037
Amphenol SV MICROWAVE
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1 | SMPM Connector Plug, Male Pin 50 Ohms Surface Mount, Through Hole Solder | Other | 3212-60037 |
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1 | 3M 372 Series 2mm Pitch Through Hole IDC Connector, Socket, 12 Way, 4 Row | Other | 37212-62M3-003PL |
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1 | Headers & Wire Housings 12P STRT PRESSLATCH .112" TAIL LENGTH | Other | 155212-6302-RB |
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INA2126UE4
Texas Instruments
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1 | Instrumentation Amplifiers Micropower Single & Dual Versions | Small Outline Packages | INA2126UE4 |
3
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GG0402126R042P
Kyocera AVX
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1 | ESD Suppressors / TVS Diodes SMP Diode 0402 12V 6pF <18V Clamp@1a | Other | GG0402126R042P |
3
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V62/12606-01XE
Texas Instruments
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1 | RS-422 Interface IC EP Dual High-Speed Diff Line Driver | Small Outline Packages | V62/12606-01XE |
3
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MAL212618681E3
Vishay
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1 | Aluminum Electrolytic Capacitors - Axial Leaded 680uF 63V 18x30 | Capacitors, Polarized Axial Diameter Horizontal Mounting | MAL212618681E3 |
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V62/12627-01XE
Texas Instruments
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1 | Operational Amplifiers - Op Amps EP 36-V Sgl Supply Lo Pwr Op-Amp | SO Transistor Flat Lead | V62/12627-01XE |
3
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SF1212-6000-TD
Amphenol SV MICROWAVE
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1 | RF Connectors / Coaxial Connectors SMP M PCB Thru-Hole Conn R/A FD, Tin Dip | Other | SF1212-6000-TD |
2
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INA2126U
Texas Instruments
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1 | Micropower Instrumentation Amplifier Single and Dual Versions | Small Outline Packages | INA2126U |
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2842126-3
TE Connectivity
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1 | Board to Board & Mezzanine Connectors 6P,2MM,BRK HDR, DRVT,2.8,0.1AU,TB | Header, Vertical | 2842126-3 |
3
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45212-600230
3M
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1 | Headers & Wire Housings 12P, .050" Pitch HDR Vert Thru-Hole,30Au | Other | 45212-600230 |
3
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721-264/001-000
Wago
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1 | THT male header; 1.2 x 1.2 mm solder pin; straight; 100% protected against mismating; Pin spacing 7.5 mm; 4-pole | Other | 721-264/001-000 |
3
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22-15-2126
Molex
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1 | Molex KK Series 2.54mm 12 Way 1 Row Right Angle PCB Socket Through Hole Socket Strip | Other | 22-15-2126 |
3
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V62/12604-01XE
Texas Instruments
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1 | Operational Amplifiers - Op Amps Dual Low-Noise JFET Inp Gen-Purp Op Amp | Small Outline Packages | V62/12604-01XE |
3
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1-2842126-0
TE Connectivity
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1 | Board to Board & Mezzanine Connectors 20P,2MM,BRK HDR, DRVT,2.8,0.1AU,TB | Header, Vertical | 1-2842126-0 |
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ADSP-21261SKSTZ150
Analog Devices
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1 | ADSP-21261SKSTZ150 Analog Devices SHARC, 32bit Digital Signal Processor 150MHz 3 Mbit ROM 144-Pin LQFP | Quad Flat Packages | ADSP-21261SKSTZ150 |
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V62/12620-01XE-T
Texas Instruments
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1 | 16-bit Microcontrollers - MCU EP 16B Ultra-Low-Pwr Mixed Signal MCU | Small Outline Packages | V62/12620-01XE-T |
3
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V62/12667-01XE
Texas Instruments
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1 | Translation - Voltage Levels 16-bit Dual Bus Transceiver | Small Outline Packages | V62/12667-01XE |
3
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2842126-6
TE Connectivity
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1 | PCB Mount Header, Vertical, Board-to-Board, 12 Position, 2 mm [.079 in] Centerline, Breakaway, Gold, Through Hole - Solder, Signal, AMPMODU 2 mm | Other | 2842126-6 |
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R5F21264JFP#W4
Renesas Electronics
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1 | The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu | Quad Flat Packages | R5F21264JFP#W4 |
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R5F21266SNFP#V2
Renesas Electronics
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1 | The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu | Quad Flat Packages | R5F21266SNFP#V2 |
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![Part Image](["https://samtec-cdn.azureedge.net/kineticimages/images/product/series/tsw_thumb.png","https://samtec-cdn.azureedge.net/kineticimages/images/product/series/tsw_thumb.png",null])
![Part Image](["https://fischer.incony.de/pim/upload/fischerData/image/web/SL512126Z.jpg","https://fischer.incony.de/pim/upload/fischerData/image/web/SL512126Z.jpg",null])
![Part Image](["https://componentsearchengine.com/Images/3/824521261.jpg",null,null])
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