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0462071002
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 2 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray | Other | 0462071002 |
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46207-5002
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 2 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5002 |
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46207-4010
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 10 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-4010 |
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AX5DBF4-620.0000T
ABRACON
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1 | OSC XO 620MHZ 2.5V LVDS | Other | AX5DBF4-620.0000T |
3
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46207-5006
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 6 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5006 |
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46207-8024
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 24 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-8024 |
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46207-8002
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 2 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-8002 |
3
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EXB-U24620JX
Panasonic
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1 | Series/Type: Anti-Sulfurated Chip Resistor Array, Power Rating (W): 0.063, Chip Size (LxW) (mm): 1.0 X 1.0, Resistance Values (Ω): 62, Resistance Tolerance (%): 5, Terminal Pitch (mm): 0.65, Type of Circuit: Isolated Circuit, Number of Elements (piece): 2, T.C.R (×10⁻⁶/K): ±200, Number of Terminals (piece): 4 | Other | EXB-U24620JX |
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3-1462039-8
TE Connectivity
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1 | IM06DTS=IM RELAY 140MW 12V | Other | 3-1462039-8 |
3
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AX5MCF4-620.0000
ABRACON
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1 | MEMS OSC XO 36.8640MHZ CMOS SMD | Other | AX5MCF4-620.0000 |
3
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1462042-9
TE Connectivity
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1 | TE Connectivity SPDT Non-Latching Relay Surface Mount, 12V dc Coil, 4 A General Purpose Relay | Other | 1462042-9 |
3
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1-1462039-9
TE Connectivity
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1 | DPDT Surface Mount Latching Relay 5 A, 4.5V dc For Use In Access & Transmission Equipment, Consumer Electronics, | Other | 1-1462039-9 |
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1-1462038-6
TE Connectivity
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1 | Relay PCB DPDT 2C/O 12VDC 2A | Other | 1-1462038-6 |
3
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IM23GR 2-1462039-9
TE Connectivity
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1 | TE Connectivity DPDT Non-Latching Relay PCB Mount, 5V dc Coil, 2 A | Other | IM23GR 2-1462039-9 |
3
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JANTX1N4620UR-1
Microsemi Corporation
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1 | Diode Zener Single 3.3V 5% 500mW 2-Pin DO-213AA Bag | Other | JANTX1N4620UR-1 |
2
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3146-2-00-15-00-00-08-0
Mill-Max
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1 | Contact PIN Solder ST Thru-Hole Bulk | Other | 3146-2-00-15-00-00-08-0 |
3
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1462043-3
TE Connectivity
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1 | Relay,DPDT,2A,SMT,5Vdc TE Connectivity DPST-2NO Surface Mount Non-Latching Relay, 5V dc Coil, 2 A General Purpose Relay | Other | 1462043-3 |
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46207-1012
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 12 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-1012 |
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46207-4308
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 8 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-4308 |
3
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46207-5018
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 18 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5018 |
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46207-1014
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 14 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-1014 |
3
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46207-0222
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 22 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-0222 |
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AX7PAF4-620.0000T
ABRACON
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1 | XTAL OSC XO 620.0000MHZ LVPECL | Other | AX7PAF4-620.0000T |
3
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AX7MBF4-620.0000
ABRACON
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1 | XTAL OSC XO 620.0000MHZ CML SMD | Other | AX7MBF4-620.0000 |
3
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AX7PAF4-620.0000C
ABRACON
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1 | XTAL OSC XO 620.0000MHZ LVPECL | Other | AX7PAF4-620.0000C |
3
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