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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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2132250571
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Vertical, 0.76µm Gold (Au) Plating, 5 Circuits, Black | Other | 2132250571 |
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20021321-00010C4LF
Amphenol Communications Solutions
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1 | Minitek127®, Board to Board connectors, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, 10 Positions, 1.27mm (0.05inch) pitch | Other | 20021321-00010C4LF |
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TFCR0603-10W-C-2132DT
Venkel
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1 | Thin Film CR,0603,1/10W,?50PPM,21.3K,?0.5% | Other | TFCR0603-10W-C-2132DT |
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TFCR1210-4W-K-2132FT
Venkel
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1 | Thin Film CR,1210,1/4W,?100PPM,21.3K,?1% | Other | TFCR1210-4W-K-2132FT |
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AP2132BMP-1.2TRG1
Diodes Incorporated
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1 | DiodesZetex AP2132BMP-1.2TRG1, Low Noise LDO Voltage Regulator, 2A, 1.2 V 2%, 1.4 → 5.5 Vin, 8-Pin PSOP | Small Outline Packages | AP2132BMP-1.2TRG1 |
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UPTF0805-10W-N-2132UT
Venkel
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1 | Ultra Precision Thin Film CR,0805,1/10W,?10PPM,21.3K,?0.01% | Other | UPTF0805-10W-N-2132UT |
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2132415-4
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 4 | Connector Contact Load Condition Fully Loaded | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 4.2 AMP | Mating Pin Diameter .024 INCH | Mating Pin Diameter .6 MM | Contact Mating Area Length .142 INCH | Contact Mating Area Plating Material Tin | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.032 MICM | Contact Shape & Form Roun | Header, Shrouded - Straight PTH Box | 2132415-4 |
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TFCR0402-16W-K-2132FT-1K
Venkel
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1 | Thin Film CR,0402,1/16W,?100PPM,21.3K,?1% | Other | TFCR0402-16W-K-2132FT-1K |
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2132250630
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Vertical, 0.38µm Gold (Au) Plating, 6 Circuits, Natural | Other | 2132250630 |
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2132415-6
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 6 | Number of Rows 1 | Connector Contact Load Condition Fully Loaded | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Mating Pin Diameter .6 MM | PCB Contact Termination Area Plating Material Thickness 2.032 MICM | Mating Pin Diameter .024 INCH | Contact Current Rating (Max) 4.2 AMP | Contact Mating Area Length 3.6 MM | Contact Mating Area | Other | 2132415-6 |
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2132251430
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Vertical, 0.38µm Gold (Au) Plating, 14 Circuits, Natural | Other | 2132251430 |
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B82132A5701M000
TDK
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1 | Epcos 23 μH ±20% Carbonyl Iron Leaded Inductor, Max SRF:55MHz, 0.7A Idc, 0.73Ω Rdc VHF | Inductors, Axial Diameter Horizontal Mounting | B82132A5701M000 |
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2132261511
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Right-Angle, 0.10µm Gold (Au) Plating, 15 Circuits, Black | Other | 2132261511 |
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TFCR0603-16W-E-2132CT
Venkel
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1 | Thin Film CR,0603,1/16W,?25PPM,21.3K,?0.25% | Other | TFCR0603-16W-E-2132CT |
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UPTF1210-5W-N-2132CT
Venkel
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1 | Ultra Precision Thin Film CR,1210,1/5W,10PPM,21.3K,?0.25% | Other | UPTF1210-5W-N-2132CT |
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2132250730
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Vertical, 0.38µm Gold (Au) Plating, 7 Circuits, Natural | Other | 2132250730 |
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20021323-00008C1LF
Amphenol Communications Solutions
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1 | Minitek127® 1.27mm, Board To Board Connectors, Receptacle, Double Row, Bottom entry, 8 positions, 1.27mm (0.500in) pitch. | Other | 20021323-00008C1LF |
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2132282471
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 0.76µm Gold (Au) Plating, 24 Circuits, Black | Other | 2132282471 |
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R5F21322CNSP#30
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21322CNSP#30 |
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292132-6
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 6 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Mating Pin Diameter .024 INCH | Contact Mating Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Thickness 39.37 MICIN | Contact Shape & Form Round | Contact Shape & Form Rounded | Mating Pin Diameter .6 MM | Contact Mating Area Plating Material Thickness 1 MICM | Contact Type Pin | Contact Mating Area Length .16 | Header, Shrouded - Straight PTH Box | 292132-6 |
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2132260211
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Right-Angle, 0.10µm Gold (Au) Plating, 2 Circuits, Black | Other | 2132260211 |
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213227-2270
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Vertical, 0.10µm Gold (Au) Plating, 22 Circuits, Natural | Other | 213227-2270 |
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2132280611
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 6 Circuits, Natural | Other | 2132280611 |
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2132272611
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Vertical, 0.10µm Gold (Au) Plating, 26 Circuits, Black | Other | 2132272611 |
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560112132009
Würth Elektronik
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1 | 12 kOhms ±1% 0.25W, 1/4W Chip Resistor 1206 (3216 Metric) Anti-Sulfur Thick Film -55°C ~ 155°C | Other | 560112132009 |
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