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231-445/001-000
Wago
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1 | THT male header; 1.0 x 1.0 mm solder pin; angled; Pin spacing 5 mm; 15-pole | Other | 231-445/001-000 |
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1 | NXP LPC2378FBD144,551, 16 bit, 32 bit ARM7TDMI-S Microcontroller, 72MHz, 512 kB Flash, 144-Pin LQFP | Quad Flat Packages | LPC2378FBD144,551 |
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1445088-8
TE Connectivity
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1 | MICRO MNL HDR ASSY S/ROW AU LF | Other | 1445088-8 |
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144-5062
RS Pro
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1 | 1.3V-5.5V, 2A, 60mΩ ULTRA-LOW LEAKAGE LOAD SWITCH | Other | 144-5062 |
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2842144-5
TE Connectivity
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1 | Board to Board & Mezzanine Connectors 10P,2MM,BRK HDR,DRVT SMD,0.76AU,TR W/CAP | Other | 2842144-5 |
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144-5018
RS Pro
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0 | 50 MHz Clock Oscillator, ±50ppm CMOS, 4-Pin SMD | Other | 144-5018 |
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721-445/001-000
Wago
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1 | THT male header; 1.0 x 1.0 mm solder pin; angled; 100% protected against mismating; Pin spacing 5 mm; 15-pole | Other | 721-445/001-000 |
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345-144-520-201
EDAC
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1 | Standard Card Edge Connectors 144P .100" x .200" GREEN | Other | 345-144-520-201 |
3
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1 | MCU 32-bit ARM Cortex M4 RISC 512KB Flash 3.3V Automotive 144-Pin LQFP Tray | Quad Flat Packages | LPC4078FBD144,551 |
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AR11-4454I
Allied Components International
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1 | 1 Port RJ45 Through Hole 10/100/1000 Base-T, AutoMDIX, -40°C ~ 85°C | Other | AR11-4454I |
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1 | NXP LPC1778FBD144,551, 32bit ARM Cortex M3 Microcontroller, 120MHz, 512 kB Flash, 144-Pin LQFP | Quad Flat Packages | LPC1778FBD144,551 |
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1-1445088-0
TE Connectivity
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1 | CONN HEADER R/A 10POS 3MM | Other | 1-1445088-0 |
3
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ROB-14450
SparkFun
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1 | Power Management IC Development Tools SparkFun MotorDriver Dual TB6612FNG Head. | Other | ROB-14450 |
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SLP21614456G
Fischer Elektronik GmbH & Co. KG
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1 | Dual Row, THT, Male, Pitch 2.54mm x 2.54mm, 56 Position | Other | SLP21614456G |
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SLP21614452GECO
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | SLP21614452GECO |
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2-1445054-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Other | 2-1445054-4 |
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2-1445057-5
TE Connectivity
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1 | Configuration Features: Number of Power Positions 5 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Are | Other | 2-1445057-5 |
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2-1445085-6
TE Connectivity
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1 | Connector Header Through Hole 6 position 0.118" (3.00mm) , UL94 V-0 , 250V , 100.0µin , -40°C ~ 105°C | Other | 2-1445085-6 |
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2-1445093-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | Number of Rows 1 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Cont | Other | 2-1445093-5 |
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10144517-102802LF
Amphenol Communications Solutions
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1 | BergStak® Lite 0.80mm, Board-to-Board Connector, 100 Positions, Dual Row, Vertical Receptacle. | Other | 10144517-102802LF |
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M20-9991445
Harwin
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1 | M20: 14 Pos Plug SIL Straight 3mm THT Connector 6.1mm pin Gold | Other | M20-9991445 |
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2-1445100-5
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Positions 5 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housi | Other | 2-1445100-5 |
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TMS-144-52-L-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-52-L-S |
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TMS-144-59-SM-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-59-SM-S |
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TMS-144-57-SM-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-57-SM-S |
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![Part Image](["//media.rs-online.com/t_large/Y2780860-01.jpg",null,null])
![Part Image](["https://componentsearchengine.com/Images/9/LPC2378FBD144,551.jpg",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/2245_sot486-1_3d.gif"])
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![Part Image](["https://fischer.incony.de/pim/upload/fischerData/image/base/SLP21614456G.jpg","https://fischer.incony.de/pim/upload/fischerData/image/base/SLP21614456G.jpg",null])
![Part Image](["https://fischer.incony.de/pim/upload/fischerData/image/base/SLP21614452G.jpg","https://fischer.incony.de/pim/upload/fischerData/image/base/SLP21614452G.jpg",null])
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