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231-454/001-000
Wago
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1 | THT male header; 1.0 x 1.0 mm solder pin; angled; Pin spacing 5 mm; 24-pole | Other | 231-454/001-000 |
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449145402
Molex
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1 | Micro-Fit CPI Header, Compliant Pin Interface, Dual Row, Vertical, Tin (Sn) Plating, Glow-Wire Capable | Other | 449145402 |
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PIC16LF1454-I/ML
Microchip
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1 | Microchip PIC16LF1454-I/ML, 8bit PIC16L Microcontroller, 48MHz, 14 kB Flash, 16-Pin QFN | Quad Flat No-Lead | PIC16LF1454-I/ML |
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10145445-10003MLF
Amphenol
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1 | PCI Express / PCI Connectors PCI Express vertical Card Edge Connector 164 Positions 1mm (0039inch) Pitch | Other | 10145445-10003MLF |
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SI5332AD14541-GM1R
Skyworks
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1 | Clock Generators & Support Products Low jitter, 6-output, any-frequency (< 333.33 MHz), any output clock generator (INT+FRAC) | Quad Flat No-Lead | SI5332AD14541-GM1R |
3
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PIC16F1454-I/SL
Microchip
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1 | Microchip PIC16F1454-I/SL, 8bit PIC Microcontroller, 48MHz, 14 kB Flash, 14-Pin SOIC | Small Outline Packages | PIC16F1454-I/SL |
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TL145406DWE4
Texas Instruments
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1 | RS-232 Interface IC Triple RS-232 Drivers/Receivers | Small Outline Packages | TL145406DWE4 |
3
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PIC16F1454-I/P
Microchip
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1 | MCU,PIC16F1454,48MHz,14KB Flash,PDIP14 PIC16F1454-I/P, 8 bit PIC Microcontroller 48MHz 14 kB Flash, 1024 B RAM, USB I2C 14-Pin PDIP | Dual-In-Line Packages | PIC16F1454-I/P |
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PIC16F1454-I/JQ
Microchip
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1 | MCU 8-bit PIC RISC 14KB Flash 3.3V/5V Automotive 16-Pin UQFN EP Tube | Quad Flat No-Lead | PIC16F1454-I/JQ |
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Y1454800R000T0L
Vishay Precision Group
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1 | 800 Ohms ±0.01% 0.6W Through Hole Resistor Radial Moisture Resistant, Non-Inductive Metal Foil | Other | Y1454800R000T0L |
3
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PIC16LF1454-I/JQ
Microchip
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1 | 8-bit Microcontrollers - MCU 8 Bit MCU, 7KB Flash 512 RAM, USB 2.0 | Quad Flat No-Lead | PIC16LF1454-I/JQ |
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MC14549B
onsemi
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1 | Registers LOG CMOS SHIFT REG APPROX | Small Outline Packages | MC14549B |
3
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PIC16F1454-I/ST
Microchip
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1 | 8-bit Microcontrollers - MCU 7 KB Flash 1kB RAM 48 MHz Int Osc | Small Outline Packages | PIC16F1454-I/ST |
3
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TL145406DW
Texas Instruments
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1 | TL145406DW, Multichannel Line Transceiver, EIA/TIA-232-F, RS-232, V.28 3 3 1 120kbit/s, 16-Pin SOIC | Small Outline Packages | TL145406DW |
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MAX1454AUE/V+
Analog Devices
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1 | Sensor Interface Precision Sensor Signal Conditioner with Overvoltage Protection | Small Outline Packages | MAX1454AUE/V+ |
3
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LV14540DDAR
Texas Instruments
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1 | Switching Voltage Regulators 40V 5A 2.2MHz step-down converter 8-SO PowerPAD -40 to 125 | Small Outline Packages | LV14540DDAR |
3
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TL1454ACPWR
Texas Instruments
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1 | Dual-Channel Pulse-Width-Modulation (PWM) Control Circuit | Small Outline Packages | TL1454ACPWR |
3
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TL1454ACDG4
Texas Instruments
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1 | Switching Controllers Dual ch PWM Ctlr | Small Outline Packages | TL1454ACDG4 |
3
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TL1454ACN
Texas Instruments
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1 | Dual-Channel Pulse-Width-Modulation (PWM) Control Circuit | Dual-In-Line Packages | TL1454ACN |
3
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TFCR0805-10W-E-1454FT
Venkel
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1 | Thin Film CR,0805,1/10W,?25PPM,1.45M,?1% | Other | TFCR0805-10W-E-1454FT |
3
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MC14549BDWR2G
onsemi
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1 | All Control Inputs Positive-Edge Triggered; Supply Voltage Range = 3.0 Vdc to 18 Vdc; Chip Complexity: 488 FETs or 122 Equivalent Gates; Totally Synchronous Operation; Retriggerable; Serial Output; Capable of Driving 2 Low-Power TTL Loads, 1 Low-Power Schottky TTL Load or 2 HTL Loads Over the Rated Temperature Range; Single Supply Operation; All Outputs Buffered; Compatible with a Variety of Digital and Analog Systems such as the MC1408 8-Bit D/A Converter; Pb-Free Packages are Available | Small Outline Packages | MC14549BDWR2G |
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TFCR2512-2W-E-1454BT
Venkel
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1 | Thin Film CR,2512,1/2W,?25PPM,1.45M,?0.1% | Other | TFCR2512-2W-E-1454BT |
3
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TMS-114-54-S-S
SAMTEC
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1 | 14 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-114-54-S-S |
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214547-E
TE Connectivity
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0 | Configuration Features: Number of Positions 5 | Number of Columns 5 | Number of Power Positions 5 | Insertion Force 5 NEWT | Number of Signal Positions 0 | Number of Rows 1 | PCB Mount Orientation Vertical | Board-to-Board Configuration Parallel | Contact Features: Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Thickness 157.48 – 236.22 MICIN | Contact Mating Area Plating Material Gold (Au) | Contact Type Receptacle | Contact Layout Inline | Contact Retention Within Hou | Other | 214547-E |
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T4145415041-001
TE Connectivity
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1 | 4 Position Circular Connector, Wire-to-Panel, Sealable, Wire & Cable, Signal, Panel Mount, Reverse Gender, Nickel, Copper Alloy, B Code, M12 Connector | Other | T4145415041-001 |
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![Part Image](["https://componentsearchengine.com/2D/0/18587736.png",null,null])
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