19383 Model Download Search Results
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193839-2
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | PCB Mount Orientation Right Angle | Number of Rows 0 | Contact Features: Contact Mating Area Plating Material Thickness 5.08 MICM | Contact Current Rating (Max) 36 AMP | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Silver | Contact Mating Area Plating Material Thickness 200 MICIN | Contact Type Socket | PCB Contact Termination Area Plating Material Thickness 200 MICIN | Contact Mating Area Pla | Other | 193839-2 |
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919-383J-51A
Amphenol
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1 | RF Connectors / Coaxial Connectors MCX 5O OHM JACK R/A T/H MNT | Other | 919-383J-51A |
2
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1719383
Phoenix Contact
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1 | SPT 5/ 9-V-7,5-ZB - Printed circuit board terminal, nominal current: 41 A, rated voltage (III/2): 1000 V, nominal cross section: 6 mm2, number of potentials: 9, number of rows: 1, number of positions per row: 9, product range: SPT 5/..-V, pitch: 7.5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90 °, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 4.6 mm, number of solder pins per potential: 1, type of packaging: packed | Other | 1719383 |
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1938340000
Weidmüller
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1 | Multi-tier modular terminal, Tension-clamp connection, 2.5 mm², 800 V, 24 A, Number of levels: 2, brown, dark beige, | 1938340000 |
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193837-6
TE Connectivity
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1 | Connector Accessory, Contact, Copper Alloy | 193837-6 |
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193839-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Rows 0 | Contact Features: PCB Contact Termination Area Plating Material Thickness 5.08 MICM | Contact Retention Within Housing Without | Contact Type Socket | Contact Layout Inline | Contact Mating Area Plating Material Thickness 200 MICIN | PCB Contact Termination Area Plating Material Thickness 200 MICIN | Contact Mating Area Plating Material Silver | Contact Current Rating (Max) 36 AMP | Contact Mating Area Pla | 193839-3 |
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1938323-5
CommScope Inc
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1 | Cable Assembly, 8 Conductor(s), Fiber Optic Cable | 1938323-5 |
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1938324-3
TE Connectivity
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1 | Cable Assembly | 1938324-3 |
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193837-3
TE Connectivity
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1 | Connector Accessory, Contact, Copper Alloy | 193837-3 |
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193837-2
TE Connectivity
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1 | Contact Features: Contact Underplating Material Thickness .5 MICIN | Contact Underplating Material Nickel | Mating Pin Diameter .157 INCH | Contact Mating Area Plating Material Thickness .005 MICM | Contact Underplating Material Thickness .01 MICM | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .2 MICIN | Contact Type Pin | Contact Mating Area Plating Material Silver | Contact Retention Within Housing With | Contact Current Rating (Max) 24 AMP | Wire Contact Termination | 193837-2 |
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193839-4
TE Connectivity
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1 | SKT HEADER, RIGHT ANGLE | 193839-4 |
1
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1938304
Phoenix Contact
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1 | Strip Terminal Block, 12A, 1 Row(s), 1 Deck(s) | 1938304 |
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193839-1
TE Connectivity
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1 | Configuration Features: Number of Rows 0 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Layout Inline | Contact Mating Area Plating Material Thickness 200 MICIN | PCB Contact Termination Area Plating Material Silver | PCB Contact Termination Area Plating Material Thickness 200 MICIN | Contact Mating Area Plating Material Thickness 5.08 MICM | Contact Current Rating (Max) 36 AMP | Contact Retention Within Housing Without | Contact Type Socket | PCB Contact Termination | 193839-1 |
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193837-8
TE Connectivity
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1 | Connector Accessory | 193837-8 |
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193836-2
TE Connectivity
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1 | Connector Accessory, Contact, Copper Alloy | 193836-2 |
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193837-4
TE Connectivity
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1 | Contact Features: Mating Pin Diameter .236 INCH | Contact Orientation Straight | Contact Mating Area Plating Material Thickness .005 MICM | Contact Underplating Material Thickness .5 MICIN | Contact Current Rating (Max) 24 AMP | Wire Contact Termination Area Plating Thickness .005 MICM | Contact Type Pin | Mating Pin Diameter 6 MM | Contact Underplating Material Thickness .01 MICM | Contact Mating Area Plating Material Silver | Contact Retention Within Housing With | Wire Contact Termination Area Plating Ma | 193837-4 |
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193839-5
TE Connectivity
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1 | Combination Line Connector, 8 Contact(s), Female, Solder Terminal | 193839-5 |
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193837-5
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Silver | Contact Underplating Material Thickness .5 MICIN | Contact Type Pin | Contact Base Material Copper Alloy | Contact Retention Within Housing With | Contact Orientation Straight | Mating Pin Diameter 6 MM | Contact Mating Area Plating Material Thickness .005 MICM | Wire Contact Termination Area Plating Thickness .2 MICIN | Contact Underplating Material Thickness .01 MICM | Contact Underplating Material Nickel | Wire Contact Termination Area Plati | 193837-5 |
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193837-7
TE Connectivity
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1 | Contact Features: Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Contact Mating Area Plating Material Silver | Mating Pin Diameter 8 MM | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness .005 MICM | Contact Mating Area Plating Material Thickness .2 MICIN | Contact Underplating Material Thickness .5 MICIN | Wire Contact Termination Area Plating Thickness .2 MICIN | Contact Type Pin | Mating Pin Diameter .315 INCH | Contact Underplating Material Thick | 193837-7 |
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1938323-1
CommScope Inc
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1 | Cable Assembly, 8 Conductor(s), Fiber Optic Cable | 1938323-1 |
0
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1938330000
Weidmüller
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1 | Multi-tier modular terminal, Tension-clamp connection, 2.5 mm², 800 V, 24 A, Number of levels: 2, brown, dark beige, | 1938330000 |
1
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193837-1
TE Connectivity
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1 | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Current Rating (Max) 30 AMP | Wire Contact Termination Area Plating Material Silver | Contact Type Pin | Wire Contact Termination Area Plating Thickness 200 MICIN | Wire Contact Termination Area Plating Thickness 5.08 MICM | Contact Base Material Copper Alloy | Wire Contact Termination Area Plating Material Finish Semi-Bright | Contact Mating Area Plating Material Thickness 2 – 3 MICM | Contact Orientation Straight | Mating Pin D | 193837-1 |
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1938317
Phoenix Contact
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1 | MKDSN 2,5/ 4 BK - Printed circuit board terminal, nominal current: 24 A, rated voltage (III/2): 400 V, nominal cross section: 2.5 mm2, number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: MKDSN 2,5, pitch: 5 mm, connection method: Screw connection with tension sleeve, screw head form: H1L Slotted Phillips recess, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solde | 1938317 |
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PS-5011-DFE-204X-1986M819383
Vectron International (now Microchip)
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1 | SAW Oscillator, 1986.819383MHz Nom | PS-5011-DFE-204X-1986M819383 |
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VS-7010-EEE-205X-1986M819383
Vectron International (now Microchip)
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1 | SAW Oscillator | VS-7010-EEE-205X-1986M819383 |
0
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/001/938/392/193839-2-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/001/938/392/193839-2-t1.jpg/jcr:content/renditions/product-details.png",null])
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