21711 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	217-11 Wilco Corporation	1	General Purpose Inductor, 10uH, 10%,		217-11	3D model not available Symbol and footprint not available 0	0 Build or Request
	10061122-171120HLF Amphenol	1	17 Position FPC Connector Contacts, Bottom 0.012" (0.30mm) Surface Mount, Right Angle	Other	10061122-171120HLF	3D model available Symbol and footprint available 3	1 Download Model
	C0603C473K4RAC31217111 KEMET	1	Cap Ceramic 0.047uF 16V X7R 10% Pad SMD 0603 125°C	Other	C0603C473K4RAC31217111	3D model available Symbol and footprint available 3	1 Download Model
	C0603C101J5GAC31217111 KEMET	1	100.PF 50.0V	Capacitor Chip Non-polarised	C0603C101J5GAC31217111	3D model available Symbol and footprint available 3	1 Download Model

	C0603C104J4RAC31217111 KEMET	1	.100UF 16.0V	Capacitor Chip Non-polarised	C0603C104J4RAC31217111	3D model available Symbol and footprint available 3	1 Download Model
	621-71-10GB12 PINREX	1	2.0mm Female Header SMT Type H=4.3mm, 500VDC, 100mA.	Other	621-71-10GB12	3D model available Symbol and footprint available 3	1 Download Model
	C0603C102K5RAC31217111 KEMET	1	1000PF 50.0V	Capacitor Chip Non-polarised	C0603C102K5RAC31217111	3D model available Symbol and footprint available 3	1 Download Model
	C0603C223K5RAC31217111 KEMET	1	Cap Ceramic 0.022uF 50V X7R 10% Pad SMD 0603 125°C	Capacitor Chip Non-polarised	C0603C223K5RAC31217111	3D model available Symbol and footprint available 3	1 Download Model
	1821711 Phoenix Contact	1	PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, type of contact: Male connector, Number of potentials: 4, Number of rows: 1, Number of positions per row: 4, number of connections: 4, product range: MC 0,5/..-G-SMD, pitch: 2.54 mm, mounting: SMD soldering, pin layout: Linear pad geometry, Stecksystem: MICRO COMBICON - FMC 0,5, Locking: without, type of packaging: 24 mm wide tape, Sample values available under SAMPLE MC...	Other	1821711	3D model available Symbol and footprint available 3	1 Download Model
	5352171-1 TE Connectivity	1	Body Features: Primary Product Color Gray \| Configuration Features: Mating & Unmating Configuration Make First / Break Last \| Rows Loaded D \| Rows Loaded A \| Rows Loaded B \| Number of Columns 19 \| PCB Mount Orientation Right Angle \| Rows Loaded C \| Rows Loaded E \| Number of Signal Positions 95 \| Number of Positions 95 \| Backplane Architecture Mezzanine \| Number of Rows 5 \| Contact Features: Contact Type Socket \| Contact Mating Area Plating Material Thickness 1.27 MICM \| PCB Contact Termination Area Plating	Other	5352171-1	3D model available Symbol and footprint available 3	1 Download Model
	352171-1 TE Connectivity	1	Body Features: Primary Product Color Gray \| Configuration Features: Rows Loaded D \| Number of Signal Positions 95 \| PCB Mount Orientation Right Angle \| Backplane Architecture Mezzanine \| Number of Columns 19 \| Number of Positions 95 \| Rows Loaded C \| Rows Loaded E \| Rows Loaded A \| Number of Rows 5 \| Rows Loaded B \| Contact Features: Feedthrough Post Length 3.3 MM \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .76 MICM \| PCB Contact Termination Area Plating Mate	Other	352171-1	3D model available Symbol and footprint available 3	1 Download Model
	C0603C224K3RAC31217111 KEMET	1	Multilayer Ceramic Capacitors MLCC - SMD/SMT .220UF 25.0V	Capacitor Chip Non-polarised	C0603C224K3RAC31217111	3D model available Symbol and footprint available 3	1 Download Model
	2171108-7 TE Connectivity	1	WIRE AND CABLE		2171108-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	2171120-1 TE Connectivity	1	WIRE AND CABLE		2171120-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	2171112 Lapp Group	1	Cable Assembly,		2171112	3D model not available Symbol and footprint not available 0	0 Build or Request

	2171120-7 TE Connectivity	1	WIRE AND CABLE		2171120-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	2171113 Lapp Group	1	Cable Assembly,		2171113	3D model not available Symbol and footprint not available 0	0 Build or Request
	2171108-7 CommScope Inc	1	Wire And Cable,		2171108-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	2171176 Lapp Group	1	Wire And Cable,		2171176	3D model not available Symbol and footprint not available 0	0 Build or Request
	2171185 Lapp Group	1	Telecom and Datacom Connector,		2171185	3D model not available Symbol and footprint not available 0	0 Build or Request
	2171170 Lapp Group	1	Wire And Cable,		2171170	3D model not available Symbol and footprint not available 0	0 Build or Request
	2171166 Lapp Group	1	Wire And Cable,		2171166	3D model not available Symbol and footprint not available 0	0 Build or Request
	2171120-6 TE Connectivity	1	WIRE AND CABLE		2171120-6	3D model not available Symbol and footprint not available 0	0 Build or Request
	2171120-2 CommScope Inc	1	Wire And Cable,		2171120-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	2171177 Lapp Group	1	Wire And Cable,		2171177	3D model not available Symbol and footprint not available 0	0 Build or Request
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