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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219-8LPSTR
CTS
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1 | SWITCH SLIDE DIP SPST 100MA 20V | Other | Check Price & Stock |
3
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219-8MSTR
CTS
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1 | DIP Switches / SIP Switches 8 switch sections SPST | Other | Check Price & Stock |
3
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219-8LPST
CTS
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1 | DIP Switches / SIP Switches SPST 8 switch sections | Other | Check Price & Stock |
3
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219-8MST
CTS
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1 | DIP Switches / SIP Switches SPST 8 switch sections | Other | Check Price & Stock |
3
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219-8MS
CTS
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1 | Switch DIP ON OFF SPST 8 Raised Slide 0.1A 20VDC Gull Wing 2.54mm SMD Tube | Other | Check Price & Stock |
3
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219-8LPSTRF
CTS
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1 | DIP Switches / SIP Switches SURFACE MOUNT, GOLD DIP SWITCH, 8-POLE, LOW PROFILE ACTUATOR, BOTTOM SEAL, TAPE SEAL, REEL, OFF | Other | Check Price & Stock |
3
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219-8LPSTJF
CTS
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1 | SWITCH SLIDE DIP SPST 100MA 20V | Other | Check Price & Stock |
3
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219-8MSTJR
CTS
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1 | SWITCH SLIDE DIP SPST 100MA 20V,, | Other | Check Price & Stock |
3
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219-8LPSTJR
CTS
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1 | SWITCH SLIDE DIP SPST 100MA 20V | Other | Check Price & Stock |
3
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219-8LPSTJ
CTS
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1 | SWITCH SLIDE DIP SPST 100MA 20V | Other | Check Price & Stock |
3
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2198346-7
TE Connectivity
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1 | Configuration Features: Number of Positions 320 | Number of Ports 16 | Lightpipe Style Standard | Port Matrix Configuration 2 x 8 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 | Other | Check Price & Stock |
3
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2198346-7
TE Connectivity
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1 | Configuration Features: Number of Positions 320 | Number of Ports 16 | Lightpipe Style Standard | Port Matrix Configuration 2 x 8 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 | Other | Check Price & Stock |
3
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1721986
Phoenix Contact
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1 | PCB header, nominal cross section: 1.5 mm?, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 2, Number of rows: 1, Number of positions per row: 2, number of connections: 2, product range: MC 1,5/..-G-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, Stecksystem: MINI COMBICON, Locking: without, type of packaging: packed in cardboard | Other | Check Price & Stock |
3
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2198325-7
TE Connectivity
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1 | Configuration Features: Number of Positions 80 | Number of Ports 4 | Lightpipe Style Standard | Port Matrix Configuration 2 x 2 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G | Other | Check Price & Stock |
3
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2198230-3
TE Connectivity
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1 | Body Features: Heat Sink Height .358 INCH | Heat Sink Height Class Networking Short | Heat Sink Height 9.1 MM | Heat Sink Style Pin | Configuration Features: Number of Ports 2 | Port Matrix Configuration 1 x 2 | Dimensions: PCB Thickness (Recommended) 2.25 MM | PCB Thickness (Recommended) .089 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Pluggable I/O Applications SFP | Other | Check Price & Stock |
3
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0326-2-19-80-06-80-10-0
Mill-Max
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1 | IC & Component Sockets 200u SN OVER NI 6 CON | Other | Check Price & Stock |
3
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2198325-6
TE Connectivity
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1 | Configuration Features: Number of Positions 80 | Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G | Other | Check Price & Stock |
3
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2198318-6
TE Connectivity
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1 | Configuration Features: Number of Positions 40 | Port Matrix Configuration 2 x 1 | Number of Ports 2 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G | Other | Check Price & Stock |
3
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2198318-6
TE Connectivity
|
1 | Configuration Features: Number of Positions 40 | Port Matrix Configuration 2 x 1 | Number of Ports 2 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G | Other | Check Price & Stock |
3
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1332198
Phoenix Contact
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1 | SMD male connector, Nominal current at 20 °C: 0.5 A, Test voltage: 500 V AC, number of positions: 80, pitch: 0.635 mm, color: black, contact surface: Gold | Other | Check Price & Stock |
3
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2198325-6
TE Connectivity
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1 | Configuration Features: Number of Positions 80 | Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G | Other | Check Price & Stock |
3
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2-1986711-4
TE Connectivity
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1 | Body Features: Primary Product Color Green | Product Orientation Vertical | Lever Color White | Configuration Features: Wire Entry Location Side | Number of Rows 2 | Wire Entry Angle 90° | Number of Positions 24 | Stacking Configuration Side Stackable | Contact Features: Contact Base Material Copper Alloy | Contact Mating Area Length 3.5 MM | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 16 AMP | Contact Mating Area Length .138 INCH | Dimensions: Wire Size .05 – 3 MMSQ | Wire Si | Other | Check Price & Stock |
3
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2198230-4
TE Connectivity
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1 | Body Features: Heat Sink Height 13.5 MM | Heat Sink Height Class Networking Tall | Heat Sink Style Pin | Heat Sink Height .531 INCH | Configuration Features: Port Matrix Configuration 1 x 2 | Number of Ports 2 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Pluggable I/O Applications SFP+ Enhanced | Heat Sink Comp | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2198325-7
TE Connectivity
|
1 | Configuration Features: Number of Positions 80 | Number of Ports 4 | Lightpipe Style Standard | Port Matrix Configuration 2 x 2 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G | Other | Check Price & Stock |
3
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2198233-3
TE Connectivity
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1 | Body Features: Heat Sink Height 9.1 MM | Heat Sink Height .358 INCH | Heat Sink Height Class Networking Short | Heat Sink Style Pin | Configuration Features: Port Matrix Configuration 1 x 4 | Number of Ports 4 | Lightpipe Style Reduced Length | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Other | Check Price & Stock |
3
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||