60-82 Model Download Search Results
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0805Y0160822MXT
Knowles
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Capacitor Chip Non-polarised | 0805Y0160822MXT |
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39960-8208
Molex
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1 | Fixed Terminal Blocks SR BTS 8MM HORIZ 8 ASY 30 AMP | Other | 39960-8208 |
3
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0805J0160821FFT
Knowles
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Capacitor Chip Non-polarised | 0805J0160821FFT |
3
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0805J0160820KFT
Knowles
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Capacitor Chip Non-polarised | 0805J0160820KFT |
3
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1210J0160824MXR
Knowles
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Capacitor Chip Non-polarised | 1210J0160824MXR |
3
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LTC6082CGN#PBF
Analog Devices
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1 | LINEAR TECHNOLOGY - LTC6082CGN#PBF - Operational Amplifier, Quad, 4 Amplifier, 3.6 MHz, 1 V/µs, 2.7V to 5.5V, SSOP, 16 Pins | Small Outline Packages | LTC6082CGN#PBF |
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EBTF-6-08-2.0-S-RA-1-L-G
SAMTEC
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1 | Conn Backplane RCP 96 POS 1mm Press-Fit RA Through Hole - Bulk | Other | EBTF-6-08-2.0-S-RA-1-L-G |
3
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M80-8660822
Harwin
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1 | Datamate L-Tek: 4+4 Pos Plug DIL Right-Angle 3mm THT Connector Latches Gold+Tin/Lead | Other | M80-8660822 |
3
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6-1460820-2
TE Connectivity
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1 | Body Features: Body Material Copper Zinc | Body Material Finish Plated | Body Plating Material Gold | Configuration Features: PCB Mount Orientation Right Angle | Number of Coaxial Contacts 1 | Number of Positions 1 | Contact Features: RF Connector Center Contact Underplating Material Nickel | RF Connector Center Contact Plating Material Tin | Dimensions: Profile Height from PCB .198 INCH | Profile Height from PCB 5.05 MM | Electrical Characteristics: Impedance 50 OHM | Mechanical Attachment: Detent Without | Other | 6-1460820-2 |
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3560820RJT
TE Connectivity
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1 | TE Connectivity 820Ω, 4257 (11070M Thick Film SMD Resistor ±5% 6W - 3560820RJT | Resistor Chip | 3560820RJT |
3
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2SC6082-1E
onsemi
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1 | Adoption of MBIT process; Large current capacitance; Low collector to emitter saturation voltage; High speed switching | Transistor Outline, Vertical | 2SC6082-1E |
3
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M80-6660822
Harwin
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1 | Datamate L-Tek: 4+4 Pos Plug DIL Right-Angle SMT Connector Latches Gold+Tin/Lead | Other | M80-6660822 |
3
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AEF0608220M063R
Kyocera AVX
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1 | Aluminum Electrolytic Capacitors - SMD 63V 22uF 6000Hrs 20% ESR=4.6Ohms | Capacitor Al Electrolytic | AEF0608220M063R |
3
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RPA0608221M016B
Kyocera AVX
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1 | Aluminum Organic Polymer Capacitors 16V 220uF 0608 ESR=15mOhms | Capacitor, Polarized Radial Diameter | RPA0608221M016B |
3
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LMC6082IMX/NOPB
Texas Instruments
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1 | Precision CMOS Dual Operational Amplifier | Small Outline Packages | LMC6082IMX/NOPB |
3
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LMC6082IN/NOPB
Texas Instruments
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1 | Precision CMOS Dual Operational Amplifier | Dual-In-Line Packages | LMC6082IN/NOPB |
3
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HK16082N2S-T
TAIYO YUDEN
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1 | Fixed Inductors 0603 2.2nH 100mOhms +/-.3nHTol 300mA HiQ | Inductors Chip | HK16082N2S-T |
3
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1210J0160822JFT
Knowles
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Capacitor Chip Non-polarised | 1210J0160822JFT |
3
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505066-0822
Molex
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1 | SlimStack Board-to-Board Connector, 0.35mm Pitch, SSB RP Series, Receptacle, 0.60mm Mated Height, 2.00mm Mated Width, 8 Circuits, Armor Nail | Other | 505066-0822 |
3
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SRR1260-820M
Bourns
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1 | Fixed Inductors 82uH 20% SMD 1260 | Inductors Precision Moulded | SRR1260-820M |
3
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LMC6082AIN/NOPB
Texas Instruments
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1 | Texas Instruments LMC6082AIN/NOPB, Dual Op Amp, 1.3MHz CMOS, Rail to Rail, 5 → 15 V, 8-Pin MDIP | Dual-In-Line Packages | LMC6082AIN/NOPB |
3
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EBTM-6-08-2.0-S-VT-1-L
SAMTEC
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1 | High Speed / Modular Connectors ExaMAX 2.00 mm High-Speed Backplane Vertical Header | Other | EBTM-6-08-2.0-S-VT-1-L |
3
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MH1608-221Y
Bourns
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1 | Ferrite Beads 220 ohms 25% HIGH CURRENT | Ferrite Bead Chip | MH1608-221Y |
3
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1210Y0160821GFT
Knowles
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Capacitor Chip Non-polarised | 1210Y0160821GFT |
3
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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1206J0160821MXR
Knowles
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Capacitor Chip Non-polarised | 1206J0160821MXR |
3
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