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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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3-794618-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Rows 2 | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Other | 3-794618-6 |
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4-794618-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 18 | PCB Mount Orientation Right Angle | Number of Positions 18 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Other | 4-794618-8 |
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3-794619-8
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 8 | Number of Power Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Co | Other | 3-794619-8 |
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5-794618-0
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Mating Area Plating Materi | Other | 5-794618-0 |
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3-794619-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 | Other | 3-794619-2 |
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4-794618-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.8 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Retention Within Ho | Other | 4-794618-6 |
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3-794618-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | C | Other | 3-794618-4 |
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4-794618-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 10 | Number of Positions 10 | Contact Features: Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plat | Other | 4-794618-0 |
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5-794618-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 22 | Number of Rows 2 | Number of Positions 22 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Platin | Other | 5-794618-2 |
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3-794618-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | Number of Rows 2 | Number of Power Positions 8 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | | Other | 3-794618-8 |
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BFC247946114
Vishay
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1 | 0.11 µF Film Capacitor 160V 250V Polypropylene (PP), Metallized Radial | Other | BFC247946114 |
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4-794619-6
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 16 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Micro MATE-N-LOK | Other | 4-794619-6 |
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5-794618-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Rows 2 | Number of Power Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 | Other | 5-794618-4 |
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5-794619-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 22 | Number of Positions 22 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Th | Other | 5-794619-2 |
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3-794618-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Ar | Other | 3-794618-2 |
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4-794618-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 12 | Number of Rows 2 | Number of Positions 12 | Contact Features: Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Other | 4-794618-2 |
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4-794618-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 14 | Number of Positions 14 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Multi | Other | 4-794618-4 |
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4-794619-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 12 | Number of Positions 12 | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating | Other | 4-794619-2 |
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3-794619-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Ma | Other | 3-794619-6 |
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1-794618-2
TE Connectivity
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1 | 12POS MICRO MNL ASSY, R/A HDR ROHS COMPLIANT: NO | Other | 1-794618-2 |
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4-794619-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | PCB Mount Orientation Right Angle | Number of Positions 10 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Multiple Contact Types | Other | 4-794619-0 |
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3-794619-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Materi | Other | 3-794619-4 |
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794613-2
TE Connectivity
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1 | Connector Accessory, 0.035in Min Cable Dia, 0.059in Max Cable Dia, Contact, Brass | 794613-2 |
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794619-8
TE Connectivity
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1 | Combination Line Connector, 8 Contact(s), Male, Solder Terminal, Receptacle | 794619-8 |
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794616-2
TE's AMP
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1 | 2 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, CRIMP, PLUG, ROHS COMPLIANT | 794616-2 |
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