BCP56T1G Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
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BCP56T1G onsemi
1 The SOT-223 package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die; PNP Complement is BCP53T1; Available in 12 mm Tape and Reel Use BCP56T1 to order the 7 inch/1000 unit reel Use BCP56T3 to order the 13 inch/4000 unit reel; Device Marking BCP56T1 = BH BCP56-10T1 = BH-10 BCP56-16T1 = BH-16; High Current: 1.0 Amp; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; SOT223 (3-Pin) BCP56T1G 1 Download Model
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BCP56T1G Rochester Electronics LLC
1 1A, 80V, NPN, Si, POWER TRANSISTOR, TO-261AA, HALOGEN FREE AND ROHS COMPLIANT, CASE 318E-04, TO-261, 4 PIN BCP56T1G 0 Build or Request
Part Image Part Image 1 The SOT-223 package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die; PNP Complement is BCP53T1; Available in 12 mm Tape and Reel Use BCP56T1 to order the 7 inch/1000 unit reel Use BCP56T3 to order the 13 inch/4000 unit reel; Device Marking BCP56T1 = BH BCP56-10T1 = BH-10 BCP56-16T1 = BH-16; High Current: 1.0 Amp; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; SOT223 (3-Pin) SBCP56T1G 1 Download Model
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