MICROFJ-30035-TSV-TR Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image 1 High-density microcells; Optimized for high-performance timing applications, such as ToF-PET; Ultra-low dark count rates of 50 kHz/mm2 typical; J-Series sensors feature ON Semiconductor's unique 'fast output' terminal; Exceptional breakdown voltage uniformity of ±250 mV; Temperature stability of 21.5 mV/°C; 3 mm, 4 mm and 6 mm sensor sizes; Available in a reflow solder compatible TSV chip-scale package; Bias voltage of <30 V Other MICROFJ-30035-TSV-TR 1 Download Model
Part Image Part Image 1 High-density microcells; Optimized for high-performance timing applications, such as ToF-PET; Ultra-low dark count rates of 50 kHz/mm2 typical; J-Series sensors feature ON Semiconductor's unique 'fast output' terminal; Exceptional breakdown voltage uniformity of ±250 mV; Temperature stability of 21.5 mV/°C; 3 mm, 4 mm and 6 mm sensor sizes; Available in a reflow solder compatible TSV chip-scale package; Bias voltage of <30 V Other MICROFJ-30035-TSV-TR1 1 Download Model
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