The recommended PCB footprint for the 0217010.HXP is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a 0.2 mm spacing between pads.
Yes, the 0217010.HXP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
The 0217010.HXP is designed to handle surge currents up to 100 A, making it suitable for applications where high inrush currents are expected.
Yes, the 0217010.HXP is compatible with lead-free soldering processes, making it suitable for use in RoHS-compliant designs.
The typical response time of the 0217010.HXP is less than 1 μs, making it suitable for applications where fast overcurrent protection is required.
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0217010.HXP Overview
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