Please enter a minimum 3 letters or numbers
Technical Content
Part Image

104744-2 - TE Connectivity

Description: Body Features: Primary Product Color Black | Configuration Features: Board-to-Board Configuration Parallel | Number of Positions 30 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .762 MICM | Contact Mating Area Plating Material Gold | Contact Type Socket | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 4 AMP | Dimensions: PCB Thickness (Recommended) 1.57 MM | Row-to-Row Spacing .1 INCH | PCB Thick

ECAD model is currently unavailable for this part
Note! To download footprints and symbols, use the build and request forms below

Build this Model

Launch Build Wizard
Build Wizard not available for this package category!
or

Request this Model (48 hours)

Datasheet PDF Preview

104744-2 Overview

No models are available for download for 104744-2. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 10474, or try a keyword search, such as Terminals and Terminal Blocks

Parts related to 104744-2

Showing 0 results

Part Image

← Prev Next →

Select Package Category

Quick Jump

- Aluminium Electrolytic Capacitor
- Axial Diameter Horizontal Mount
- BGA
- Chip Array
- Chip Non-Polarised
- Chip Polarised
- Connector
- Dual-In-Line Sockets
- Header, Receptacle
- Header, Shrouded
- Header, Unshrouded
- Moulded Non-Polarised
- Moulded Polarised
- QFN
- QFP-PLCC
- Radial Diameter
- SIL-MIL
- Small Outline Diode
- SON
- SOT
- Transistor Outline, Vertical
- Other

Package Categories

Close
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑