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132312-1 - TE Connectivity

Description: Contact Features: Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 30 MICIN | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Mating Pin Diameter 1.57 MM | Contact Current Rating (Max) 13 AMP | Mating Pin Diameter .062 INCH | Contact Underplating Material Thickness .76 MICM | Wire Contact Termination Area Plating Material Finish Matte | Contact Mati

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132312-1 - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

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Moulded Polarised

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QFP-PLCC

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SIL-MIL

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