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132313-1 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Mating Pin Diameter .062 INCH | Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Thickness .76 MICM | Contact Orientation Straight | Contact Underplating Material Thickness 30 MICIN | Contact Size Size 16 | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Material Gold | Contact Mating Area Plating Materi

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132313-1 - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

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