133934-E - TE Connectivity
Description: Body Features: Shield Material Copper Alloy | Connector Profile Standard | Shield Plating Material Tin | Shield Plating Material Nickel | Configuration Features: PCB Mount Orientation Vertical | Port Configuration Single Port | Port Matrix Configuration 1 x 1 | Connector Contact Density Standard | Number of Loaded Positions 8 | Number of Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Ma
ECAD model is currently unavailable for this part
