1473151-1 - TE Connectivity
Description: Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 70 | Number of Signal Positions 70 | Number of Dual Positions 0 | Contact Features: Contact Type Socket | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 3 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Base Material Copper Alloy | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Gold |
ECAD model is currently unavailable for this part
