1586821-2 - TE Connectivity
Description: Configuration Features: Number of Loaded Positions 12 | Number of Rows 2 | Number of Columns 8 | Number of Power Positions 12 | Number of Positions 16 | PCB Mount Orientation Right Angle | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Layout Matrix | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating
ECAD model is currently unavailable for this part
