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167020-1 - TE Connectivity

Description: Contact Features: PCB Contact Termination Area Plating Material Thickness .5 MICM | Contact Current Rating (Max) 3 AMP | Contact Mating Area Plating Material Thickness .8 MICM | Contact Mating Area Plating Material Thickness 31.496 MICIN | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Type Socket | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 19.685 MICIN | Contact Orientation Straight | Contact Unde

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167020-1 - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

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Transistor Outline, Vertical

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