1744560-4 - TE Connectivity
Description: Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 80 MICIN | Contact Type Pin | Contact Underplating Material Nickel | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Finish Bright | Contact Current Rating (Max) 4.2 AMP | Contact Mating Area Plating Material Thickness 2 MICM | Housing Features: Centerline (Pitch) .098 INCH | Centerline (Pitch) 2.5 MM | Housing
ECAD model is currently unavailable for this part
