Component Search Engine - Free access to schematic symbols, PCB footprints and 3D models

2007263-3 - TE Connectivity

Description: Configuration Features: Port Matrix Configuration 1 x 2 | Number of Ports 2 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible No | Circuit Application Signal | Pluggable I/O Applications SFP+ | Other: Included Lightpipe No | EMI Containment Feature Type Internal/External EMI Springs | Packaging Features: Packaging Method Bo

ECAD model is currently unavailable for this part

Note! To download footprints and symbols, use the build and request forms below

Build this Model Build

Package Category Launch Build Wizard

Request this Model (48 hours)

2007263-3 Overview

No models are available for download for 2007263-3. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.

To find more CAD model downloads similar to this part, try a partial part number search, like 20072, or try a keyword search, such as Assembly Items

Parts related to 2007263-3

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →

2007263-3 - TE Connectivity

Build this Model Build

Request this Model (48 hours)

Datasheet PDF Preview

2007263-3 Overview

Parts related to 2007263-3

Select Package Category

Quick Jump

Package Categories

Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

Other