Part Image

203185-E - TE Connectivity

Description: Body Features: Shield Plating Material Nickel | Modular Jack Latch Orientation Standard - Latch Down | Shield Material Copper Alloy | Connector Profile Standard | Configuration Features: Port Matrix Configuration 1 x 4 | Connector Contact Density Standard | Number of Positions 32 | PCB Mount Orientation Right Angle | Port Configuration Multiple Ports | Number of Loaded Positions 32 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold (Au) |

ECAD model is currently unavailable for this part
Note! To download footprints and symbols, use the build and request forms below

Build this Model

Launch Build Wizard
Build Wizard not available for this package category!
or

Request this Model (48 hours)

Datasheet PDF Preview

203185-E Overview

No models are available for download for 203185-E. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 20318, or try a keyword search, such as Telecom and Datacom Connectors

Parts related to 203185-E

Showing 0 results

Select Package Category

Package Categories