Please enter a minimum 3 letters or numbers
Technical Content
Part Image

215192-2 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Orientation Straight | Contact Mating Area Plating Material Gold | Contact Type Socket | Contact Current Rating (Max) 3 AMP | PCB Contact Termination Area Plating Material Tin | Dimensions: Wire Size .05 – .12 MMSQ | Wire Size 30 – 26 AWG | Compatible Insulation Diameter Range 1.2 MM | Mechanical Attachment: Wire Insulation Support With | PCB Mount Retention Without | Contact Retention Type Within Housing Snap-In | Opera

ECAD model is currently unavailable for this part
Note! To download footprints and symbols, use the build and request forms below

Build this Model

Launch Build Wizard
Build Wizard not available for this package category!
or

Request this Model (48 hours)

Datasheet PDF Preview

215192-2 Overview

No models are available for download for 215192-2. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 21519, or try a keyword search, such as Assembly Items

Parts related to 215192-2

Showing 0 results

Part Image

← Prev Next →

Select Package Category

Quick Jump

- Aluminium Electrolytic Capacitor
- Axial Diameter Horizontal Mount
- BGA
- Chip Array
- Chip Non-Polarised
- Chip Polarised
- Connector
- Dual-In-Line Sockets
- Header, Receptacle
- Header, Shrouded
- Header, Unshrouded
- Moulded Non-Polarised
- Moulded Polarised
- QFN
- QFP-PLCC
- Radial Diameter
- SIL-MIL
- Small Outline Diode
- SON
- SOT
- Transistor Outline, Vertical
- Other

Package Categories

Close
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑