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2204510-1 - TE Connectivity

Description: Contact Features: Contact Orientation Straight | Contact Mating Area Plating Material Thickness 200 â€“ 300 MICIN | Contact Size Size 4 | Contact Retention Within Housing Without | Mating Pin Diameter 6.35 MM | Mating Pin Diameter .25 INCH | Contact Base Material Copper | Contact Underplating Material Thickness 78.74 MICIN | Contact Current Rating (Max) 110 AMP | Contact Underplating Material Copper | Contact Mating Area Plating Material Silver | Contact Mating Area Plating Material Thickness 5.08 â€“ 7.62

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2204510-1 - TE Connectivity

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