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225676-E - TE Connectivity

Description: Body Features: Terminal Profile Low | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: Contact Current Rating (Max) 160 AMP | Contact Mating Area Plating Material Tin (Sn) | Contact Mating Area Plating Material Finish Matte | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Copper | Terminal Orientation Straight | Contact Mating Area Plating Material Thickness 2 – 6 MICM | PCB Contact Ter

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225676-E Overview

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225676-E - TE Connectivity

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225676-E Overview

Parts related to 225676-E

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

Other