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225691-E - TE Connectivity

Description: Body Features: Terminal Profile Low | Configuration Features: Number of Positions 16 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2 – 6 MICM | Contact Underplating Material Copper | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2 – 6 MICM | PCB Contact Termination Area Plating Material Thickness 78.74 – 236.22 MICIN | Contact Mating Area Plating Material Finish Matte | Contact Current Rating

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225691-E Overview

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225691-E - TE Connectivity

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225691-E Overview

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

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