Component Search Engine - Free access to schematic symbols, PCB footprints and 3D models

225701-E - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 1 | Contact Features: Contact Mating Area Plating Material Thickness 78.74 â€“ 236.22 MICIN | Contact Mating Area Plating Material Tin (Sn) | Contact Underplating Material Thickness 78.74 â€“ 157.48 MICIN | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 2 â€“ 6 MICM | Contact Mating Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Finish Matte | Contact Under

ECAD model is currently unavailable for this part

Note! To download footprints and symbols, use the build and request forms below

Build this Model Build

Package Category Launch Build Wizard

Request this Model (48 hours)

225701-E Overview

No models are available for download for 225701-E. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.

To find more CAD model downloads similar to this part, try a partial part number search, like 22570, or try a keyword search, such as Terminals and Terminal Blocks

Parts related to 225701-E

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →

225701-E - TE Connectivity

Build this Model Build

Request this Model (48 hours)

Datasheet PDF Preview

225701-E Overview

Parts related to 225701-E

Select Package Category

Quick Jump

Package Categories

Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

Other