2286121-1 - TE Connectivity
Description: Configuration Features: Backplane Architecture Traditional Backplane | PCB Mount Orientation Right Angle | Number of Columns 16 | Number of Rows 7 | Number of Positions 112 | Guide Location Left | Contact Features: Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 50 MICIN | Dimensions: Row-to-Row
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