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2304NZG-1LF - Renesas Electronics

Description: The 2304NZ-1 is a high-performance, low skew, low jitter PCI/PCI-X clock driver. It is designed to distribute high-speed signals in PCI/PCI-X applications operating at speeds from 0 to 140 MHz. The 2304NZ-1 is characterized for operation from -40°C to +85°C for automotive and industrial applications.

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2304NZG-1LF - Renesas Electronics - PCB symbol
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2304NZG-1LF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG8-1
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2304NZG-1LF - Renesas Electronics - 3D model - Small Outline Packages - PGG8-1
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2304NZG-1LF Details

  • Manufacturer Part Number:

    2304NZG-1LF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    8

  • Manufacturer Package Code:

    PGG8

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    2304

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    3.8 ns

  • Propagation Delay (tpd):

    3.8 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.1 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • fmax-Min:

    140 MHz

2304NZG-1LF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN3804EJ0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring proper airflow around the device. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Renesas recommends using a low-ESR ceramic capacitor (CIN) with a value between 1uF to 10uF, and a high-frequency, low-ESR capacitor (COUT) with a value between 1uF to 22uF. The specific values depend on the application's requirements and should be determined through simulation and testing.
  • Check the PG signal timing, ensure proper voltage levels, and verify that the PG pin is not loaded with excessive capacitance. Also, review the power-up sequence and ensure that the input voltage is stable before the PG signal is asserted.
  • The OCP feature has a response time of around 1us, and the current limit threshold is typically set to 150% of the maximum rated current. However, the OCP may not trigger immediately if the overcurrent condition is brief or if the device is operating near the current limit threshold.

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2304NZG-1LF Overview

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