2311995-3 - TE Connectivity
Description: Configuration Features: Number of Positions 3 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Columns 3 | Number of Loaded Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 4.2 AMP | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Base Mater
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