Component Search Engine - Free access to schematic symbols, PCB footprints and 3D models

2327544-4 - TE Connectivity

Description: Contact Features: Contact Base Material Copper Alloy | Mating Pin Diameter .24 INCH | Contact Underplating Material Thickness .02 MICIN | Contact Mating Area Plating Material Thickness 8 â€“ 12 MICM | Contact Underplating Material Thickness .5 MICM | Mating Pin Diameter 6 MM | Wire Contact Termination Area Plating Material Silver | Contact Orientation Straight | Contact Underplating Material Copper | Contact Mating Area Plating Material Silver (Ag) | Contact Type Socket | Contact Mating Area Plating Materia

ECAD model is currently unavailable for this part

Note! To download footprints and symbols, use the build and request forms below

Build this Model Build

Package Category Launch Build Wizard

Request this Model (48 hours)

2327544-4 Overview

No models are available for download for 2327544-4. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.

To find more CAD model downloads similar to this part, try a partial part number search, like 23275, or try a keyword search, such as Assembly Items

Parts related to 2327544-4

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →

2327544-4 - TE Connectivity

Build this Model Build

Request this Model (48 hours)

Datasheet PDF Preview

2327544-4 Overview

Parts related to 2327544-4

Select Package Category

Quick Jump

Package Categories

Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

Other