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2356320-3 - TE Connectivity

Description: Configuration Features: Number of Positions 74 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .381 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Base Material Copper Alloy | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch)

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2356320-3 - TE Connectivity

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