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2356320-4 - TE Connectivity

Description: Configuration Features: Number of Rows 2 | Number of Positions 74 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) .5 AMP | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .762 MICM | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pi

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2356320-4 - TE Connectivity

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